myالوثائق الفنية
Copolyamide hotmelt adhesive. Used in manufacture of films and pastes, paste dot and powder dot.
تفاصيل
نوع المنتج
منتج
المورد
التركيب الكيميائي
Copolyamide
مزايا
- good washing resistance
- can be added to low viscous grades
- improves the resistance to strike back in pastes
تطبيقات أخرى
Adhesives > Hot-melts
معاملة
The powder can be supplied in following particle sizes:
- P1 = 0 to 80 μm
- P2 = 80 to 200 μm
- P3 = 200 to 300 μm
- P4 = 300 to 500 μm
معلومات تقنية
| كمية | قدر | وحدة | التعلیق |
|---|---|---|---|
| خصائص المظهر | |||
| Physical state | Granulated | ||
| الخصائص الفيزيائية | |||
| viscosity index | 1.7 | R307/53727;Relative solution viscosity | |
| MFI | 5 | g/10min | ISO 1133/53735;160°C, 2,16 kg |
| الخصائص الحرارية | |||
| Melting point | 116 | ºC | ISO 11357;DSC;Melting maximum |
| Heat Setting Time | 10 - 15 | s | |
| Melting point | 119 | ºC | ISO 3146;optical |
| Melting point | 115 | ºC | Kofler |
| Heat Setting Pressure | 3 - 5 | N/cm2 | |
| Tack point | 98 | ºC | Kofler |
| Bond temperature | 130 - 150 | ºC | |
| الخواص الكيميائية | |||
| Resistance to Steam | good;Degussa Method | ||
| Resistance to Washing | at 60°C;good;Degussa Method | ||
| Resistance to Dry Cleaning | very good;Degussa Method | ||