myInjection Molding Grade, PC/ABS+CNT, Electrostatic Dissipation, Low Surface Resistivity, Improved Impact Strength
Details Compound
CAS
9003-56-9
Applications
Producer
Technical data
| Quantity | Value | Unit | Comment |
|---|---|---|---|
| Physical Properties | |||
| MFI | 7 | g/10min | 250°C/10Kg |
| Specific Gravity | 1.24 | ||
| Linear Mold Shrinkage | 0.004 - 0.007 | cm/cm | Thickness 3.2 mm |
| Thermal Properties | |||
| Heat Deflection temperature | 117 | ºC | |
| Dry Time | 300 - 420 | min | |
| Mechanical Properties | |||
| Flexural strength | 98.06 | MPa | Thickness 6.4 mm |
| Izod impact strength (notched) | 44.1 | J/m | Thickness 3.2 mm |
| Flexural modulus-MD | 2942 | MPa | Thickness 6.4 mm |
| Tensile strength | 63.74 | MPa | Thickness 3.2 mm |
| Elongation at break-MD | >10 | % | Thickness 3.2 mm |
| Electrical Properties | |||
| Surface Resistance | 1.000E+004 - 1.000E+007 | ohm | IEC 60093 |
| Process Properties | |||
| Middle Barrel Temperature | 270 - 310 | ºC | |
| Mold Temperature | 60 - 80 | ºC | |
| Drying Temperature | 70 - 80 | ºC | |