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Modified polyamide/epoxy adduct. Used as curing agent and surfactant
Details
Product Type
Recommended for
Applications
Producer
Supplier
Chemical Composition
Modified polyamide/epoxy adduct
Other Applications
liquid epoxy resins in waterborne and solvent-free sealants
primers and concrete toppings
Technical data
| Quantity | Value | Unit | Comment |
|---|---|---|---|
| Appearance Properties | |||
| Physical state | Fluid | ||
| Color | <10 | Gardner | |
| Physical Properties | |||
| Density | 0.98 | g/ml | |
| Viscosity | 1500 - 3000 | cP | 25°C |
| Thermal Properties | |||
| flash point | 82 | ºC | |
| Chemical Properties | |||
| AHEW | 115 | ||
| Amin number | 380 - 420 | mg KOH/g | |
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