VESTAKEEP® 3300 G

VESTAKEEP® 3300G is an unreinforced, semi-crystalline, medium viscosity, self-extinguishing polyether ether ketone (PEEK) resin. It can be processed by injection molding and extrusion. Suitable for use in filaments and cable industry. Complies with FDA, UL flammability and EU (10/2011) regulations.

Details

Producer
Supplier
Advantages
  • excellent mechanical-, thermal-, hydrolysis-, wear- & chemical resistance
  • good electrical properties
  • good physical stability
  • dimensional stability
  • degassing
  • fire & ion extraction properties
  • processability
  • non-combustible
  • self-lubricating nature
  • recyclability
Other Applications

filaments and cable industry

Technical data

Quantity Value Unit Comment
Appearance Properties
Physical state Granulated
Physical Properties
Density 1.3 g/ml ISO 1183- 23°C
MFI 26 g/10min 380°C/5 kg- ISO 1133
Shrinkage 0.9 % ISO 294-4, 2 mm, Flow
Shrinkage 1.1 % ISO 294-4, 2 mm, Transverse
Melting range 360 - 380 ºC
Thermal Properties
Heat Deflection temperature 205 ºC ISO 75-1, 0.45 MPa, Method B
Heat Deflection temperature 155 ºC ISO 75-1, 1.8 MPa, Method A
Vicat softening temperature 335 ºC ISO 306, 10N, Method A
Flameability UL 94, 3.2 mm
Glass transition Temperature 152 ºC
Melting point 340 ºC ISO 11357, DSC - 2nd heating
Vicat softening temperature 305 ºC ISO 306, 50N, Method B
Dry Time 240 min
Mechanical Properties
Tensile Stress at yield-TD 98 Mpa ISO 527-1
Strain at break-MD 25 % ISO 527-2
Charpy Impact Strength (notched) 6 kJ/m² ISO 179/1eA, 23°C, Complete break
(Charpy Impact Strength(unnotched kJ/m² ISO 179/1eU, -30°C
Tensile modulus-MD 3600000 MPa
Charpy Impact Strength (notched) 6 kJ/m² ISO 179/1eA, -30°C, Complete break
(Charpy Impact Strength(unnotched kJ/m² ISO 179/1eU, 23°C
Chemical Properties
Water absorption 0.5 % ISO 62, 23°C, Saturation
LOI 38 % ISO 4589, 3.2 mm
Electrical Properties
Surface Resistance ohm IEC 60093
Volume resistance ohm-cm IEC 60093
Dissipation Factor 0.005 %, IEC 60250, 1 MHz
Dielectric Strength 16 Kv/mm IEC 60243-1, K20/P50
Comparative Tracking Index 200 V IEC 60112
Relative permittivity 2.8 IEC 60250, 50 Hz
Relative permittivity 2.8 IEC 60250, 1 MHz
Process Properties
Mold Temperature 160 - 200 ºC
Die Temperature 390 ºC
Drying Temperature 160 ºC