myCopolyamide hotmelt adhesive.
Details
Product Type
Applications
Producer
Supplier
Chemical Composition
Copolyamide
Advantages
- high resistance to heat
- low viscosity
- very good resistance to washing to 90°C, steam and dry-cleaning
- Contains an optical brightening agent
Other Applications
Adhesives > Hot-melts
Technical data
| Quantity | Value | Unit | Comment |
|---|---|---|---|
| Appearance Properties | |||
| Particle Size distribution | <80 | µm | |
| Physical state | powder | ||
| Physical Properties | |||
| viscosity index | 1.33 | (Solution viscosity (etarel | |
| MFI | 75 | g/10min | 160°C, 2,16 kg |
| Thermal Properties | |||
| Heat Setting Pressure | 3 - 5 | N/cm2 | |
| Heat Setting Time | 10 - 20 | s | |
| Melting point | 135 | ºC | Kofler |
| Tack point | 106 | ºC | Kofler |
| Bond temperature | 140 - 160 | ºC | |