myMulti-purpose copolyamide hotmelt adhesive. Used in textile and garment industries like paste dot, powder dot, powder scattering and general front fixing.
Details
Product Type
Applications
Producer
Supplier
Chemical Composition
Copolyamide
Advantages
- good resistance to heat
Other Applications
Adhesives > Hot-melts
Industrial Assembly > Apparel / Textile (clothing)
Technical data
| Quantity | Value | Unit | Comment |
|---|---|---|---|
| Appearance Properties | |||
| Physical state | Granulated | ||
| Physical Properties | |||
| viscosity index | 1.5 | (Solution viscosity (etarel | |
| MFI | 22 | g/10min | 160°C, 2,16 kg |
| Thermal Properties | |||
| Heat Setting Pressure | 3 - 5 | N/cm2 | |
| Heat Setting Time | 10 - 20 | s | |
| Melting point | 120 | ºC | Kofler |
| Tack point | 96 | ºC | Kofler |
| Bond temperature | 130 - 150 | ºC | |