myCopolyamide hotmelt adhesive. Used in nonwoven textile and nets.
Details
Product Type
Applications
Producer
Supplier
Chemical Composition
Copolyamide
Advantages
- Low-viscosity
- low melting temperature
- good resistance to washing
Other Applications
Adhesives > Hot-melts
Industrial Assembly > Apparel / Textile (clothing)
Non-woven textile and nets
upper dot-DD
powder dot
pressure and temperature sensitive outerwear
seam bonding
blouse interlinings
Technical data
| Quantity | Value | Unit | Comment |
|---|---|---|---|
| Appearance Properties | |||
| Physical state | Granulated | ||
| Physical Properties | |||
| MFI | 130 | g/10min | 160°C, 2,16 kg |
| viscosity index | 1.3 | (Solution viscosity (etarel | |
| Thermal Properties | |||
| Bond temperature | 130 - 150 | ºC | |
| Tack point | 95 | ºC | Kofler |
| Heat Setting Time | 10 - 20 | s | |
| Heat Setting Pressure | 3 - 5 | N/cm2 | |
| Melting point | 115 | ºC | Kofler |