myThermoplastic copolyester hotmelt adhesive. Used for textile bonding.
Details
Product Type
Applications
Producer
Supplier
Chemical Composition
Copolyamide
Advantages
- low melting temperature
- good resistance to washing to 60C and dry-cleaning
- very good resistance to steam
- Contains an optical brightening agent
Other Applications
Adhesives > Hot-melts
Industrial Assembly > Apparel / Textile (clothing)
Technical data
| Quantity | Value | Unit | Comment |
|---|---|---|---|
| Appearance Properties | |||
| Physical state | powder | ||
| Particle Size distribution | <80 | µm | |
| Physical Properties | |||
| MFI | 35 | g/10min | 160°C, 2,16 kg |
| Thermal Properties | |||
| Heat Setting Time | 10 - 20 | s | |
| Heat Setting Pressure | 3 - 5 | N/cm2 | |
| Melting point | 117 | ºC | Kofler |
| Tack point | 80 | ºC | Kofler |
| Bond temperature | 110 - 140 | ºC | |
| Mechanical Properties | |||
| viscosity number | 80 | ml/g | Solution viscosity |