myThermoplastic copolyester hotmelt adhesive.
Details
Product Type
Applications
Producer
Supplier
Chemical Composition
Copolyamide
Advantages
- Low fusing temperature
- good adhesive strength
- fusing with hand iron
Other Applications
Adhesives > Hot-melts
Technical data
| Quantity | Value | Unit | Comment |
|---|---|---|---|
| Appearance Properties | |||
| Physical state | powder | ||
| Particle Size distribution | 80 - 200 | µm | |