myCopolyamide hotmelt adhesive.
Details
Product Type
Applications
Producer
Supplier
Chemical Composition
Copolyamide
Advantages
- low melting point
- low melt viscosity
- very good adhesion to surfaces difficult to fuse and to siliconized fabrics
Other Applications
Adhesives > Hot-melts
Industrial Assembly > Apparel / Textile (clothing)
Technical data
| Quantity | Value | Unit | Comment |
|---|---|---|---|
| Appearance Properties | |||
| Physical state | powder | ||
| Particle Size distribution | <80 | µm | |