myCopolyamide hotmelt adhesive.
Details
Product Type
Applications
Producer
Supplier
Chemical Composition
Copolyamide
Advantages
- low melting point
- low viscosity
- good resistance to washing to 60C
- satisfactory resistance to steam
- very good resistance to dry-cleaning
- Contains an optical brightening agent
Other Applications
Adhesives > Hot-melts
Industrial Assembly > Apparel / Textile (clothing)
construction industries
Technical data
| Quantity | Value | Unit | Comment |
|---|---|---|---|
| Appearance Properties | |||
| Particle Size distribution | 80 - 160 | µm | |
| Physical state | powder | ||
| Physical Properties | |||
| viscosity index | 1.3 | (Solution viscosity (etarel | |
| MFI | 110 | g/10min | 160°C, 2,16 kg |
| Thermal Properties | |||
| Heat Setting Time | 10 - 20 | s | |
| Heat Setting Pressure | 2 - 5 | N/cm2 | |
| Melting point | 105 | ºC | Kofler |
| Tack point | 95 | ºC | Kofler |
| Bond temperature | 120 - 150 | ºC | |