myTechnical Documents
Copolyamide hotmelt adhesive. Used in paste dot, double dot, powder scattering, hotmelt print and extrusion.
Details
Product Type
Applications
Producer
Supplier
Chemical Composition
Copolyamide
Advantages
- high resistance to heat
- good resistance to steam and washing
- good adhesion
Other Applications
Adhesives > Hot-melts
Handling
The powder can be supplied in following particle sizes:
- P1 = 0 to 80 μm
- P2 = 80 to 200 μm
- P3 = 200 to 300 μm
- P4 = 300 to 500 μm
Technical data
| Quantity | Value | Unit | Comment |
|---|---|---|---|
| Appearance Properties | |||
| Physical state | Granulated | ||
| Physical Properties | |||
| viscosity index | 1.4 | R307/53727;Relative solution viscosity | |
| MFI | 40 | g/10min | ISO 1133/53735;160°C, 2,16 kg |
| Thermal Properties | |||
| Melting point | 116 | ºC | ISO 11357;DSC;Melting maximum |
| Melting point | 119 | ºC | ISO 3146;optical |
| Heat Setting Pressure | 3 - 5 | N/cm2 | |
| Heat Setting Time | 10 - 15 | s | |
| Melting point | 115 | ºC | Kofler |
| Tack point | 98 | ºC | Kofler |
| Bond temperature | 130 - 150 | ºC | |
| Chemical Properties | |||
| Resistance to Dry Cleaning | very good;Degussa Method | ||
| Resistance to Steam | good;Degussa Method | ||
| Resistance to Washing | at 60°C;good;Degussa Method | ||