Copolyamide hotmelt adhesive.
Details
Product Type
Applications
Producer
Supplier
Chemical Composition
Copolyamide
Advantages
- low melting point
- low melt viscosity
- very good adhesion to surfaces that are difficult to fuse such as siliconized fabrics
Other Applications
Adhesives > Hot-melts
Industrial Assembly > Apparel / Textile (clothing)
Technical data
Quantity | Value | Unit | Comment |
---|---|---|---|
Appearance Properties | |||
Physical state | powder |