Vestamelt® 750-P816/20

Copolyamide hotmelt adhesive.

Details

Product Type

Polymer > Polyamides

Applications

Adhesives

Producer

Evonik

Supplier

Evonik Iran

Chemical Composition

Copolyamide

Advantages
  • low melting temperature
  • good adhesion on difficult substrates
  • good resistance to washing to 60C
  • satisfactory resistance to steam
  • very good resistance to dry-cleaning
  • Contains an optical brightening agent
Other Applications

Adhesives > Hot-melts
Industrial Assembly > Apparel / Textile (clothing)

Technical data

Quantity Value Unit Comment
Appearance Properties
Particle size <80 µm 20 %
Particle Size distribution 80 - 160 µm
Physical state powder
Physical Properties
MFI 14 g/10min 160°C, 2,16 kg
Thermal Properties
Heat Setting Time 10 - 20 s
Heat Setting Pressure 3 - 5 N/cm2
Melting point 109 ºC Kofler
Tack point 95 ºC Kofler
Bond temperature 120 - 150 ºC