myCopolyamide hotmelt adhesive. Used in paste dot, double dot, powder scattering, hotmelt print and extrusion.
Details
Product Type
Applications
Producer
Supplier
Chemical Composition
Copolyamide
Advantages
- high resistance to heat and steam
- good adhesion
Other Applications
Adhesives > Hot-melts
Technical data
| Quantity | Value | Unit | Comment |
|---|---|---|---|
| Appearance Properties | |||
| Physical state | Granulated | ||
| Physical Properties | |||
| viscosity index | 1.3 | (Solution viscosity (etarel | |
| MFI | 100 | g/10min | 160°C, 2,16 kg |
| Thermal Properties | |||
| Tack point | 100 | ºC | Kofler |
| Melting point | 119 | ºC | |
| Melting point | 115 | ºC | Kofler |
| Heat Setting Pressure | 3 - 5 | N/cm2 | |
| Heat Setting Time | 10 - 15 | s | |
| Bond temperature | 130 - 150 | ºC | |