myTechnical Documents
Compimide® 1206R55 is a heat-curable formulated bismaleimide resin.
Details
Product Type
Industry
Producer
Supplier
Other Applications
It is recommended for the manufacture of printed wiring boards (PWB) via the prepreg route.
can also be formulated with epoxy resins to improve their temperature resistance.
Handling
supplied as a solution in N,N-dimethylformamide.
Technical data
| Quantity | Value | Unit | Comment |
|---|---|---|---|
| Resin Content | 55 ± 2 | wt% | |
| Physical Properties | |||
| Viscosity | 40 - 90 | cP | Temperature 25.0 °C@ |
| Chemical Properties | |||
| Gel time | >900 | sec. | Temperature 170 °C@ |